Journal List > Restor Dent Endod > v.45(1) > 1148380

Yu, Lim, Na, and Lee: Effect of hydrofluoric acid-based etchant at an elevated temperature on the bond strength and surface topography of Y-TZP ceramics

Abstract

Objectives

This study investigated the effects of a hydrofluoric acid (HA; solution of hydrogen fluoride [HF] in water)-based smart etching (SE) solution at an elevated temperature on yttria-stabilized tetragonal zirconia polycrystal (Y-TZP) ceramics in terms of bond strength and morphological changes.

Materials and Methods

Eighty sintered Y-TZP specimens were prepared for shear bond strength (SBS) testing. The bonding surface of the Y-TZP specimens was treated with 37% phosphoric acid etching at 20°C–25°C, 4% HA etching at 20°C–25°C, or HA-based SE at 70°C–80°C. In all groups, zirconia primers were applied to the bonding surface of Y-TZP. For each group, 2 types of resin cement (with or without methacryloyloxydecyl dihydrogen phosphate [MDP]) were used. SBS testing was performed. Topographic changes of the etched Y-TZP surface were analyzed using scanning electron microscopy and atomic force microscopy. The results were analyzed and compared using 2-way analysis of variance.

Results

Regardless of the type of resin cement, the highest bond strength was measured in the SE group, with significant differences compared to the other groups (p < 0.05). In all groups, MDP-containing resin cement yielded significantly higher bond strength values than MDP-free resin cement (p < 0.05). It was also shown that the Y-TZP surface was etched by the SE solution, causing a large change in the surface topography.

Conclusions

Bond strength significantly improved when a heated HA-based SE solution was applied to the Y-TZP surface, and the etched Y-TZP surface was more irregular and had higher surface roughness.

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Figure 1.
Shear bond strength values of yttria-stabilized tetragonal zirconia polycrystal (Y-TZP) in each group etched under various conditions with different resin cements. MDP, methacryloyloxydecyl dihydrogen phosphate; PA, phosphoric acid; HA, hydrofluoric acid; SE, smart etching. Identical uppercase letters indicate no statistically significant differences (p > 0.05).
rde-45-e6f1.tif
Figure 2.
Scanning electron microscopy (SEM) images at 30,000 times magnification of yttria-stabilized tetragonal zirconia polycrystal (Y-TZP) surfaces etched under different conditions. (A) Etching-free specimen (control); (B) 37% phosphoric acid (PA)-etched specimen; (C) 4% hydrofluoric acid (HA)-etched specimen; (D) HA-based smart etching (SE)-etched specimen.
rde-45-e6f2.tif
Figure 3.
Atomic force microscopy images of yttria-stabilized tetragonal zirconia polycrystal (Y-TZP) surfaces etched under different conditions. (A) Etching-free specimen (control); (B) 37% phosphoric acid (PA)-etched specimen; (C) 4% hydrofluoric acid (HA)-etched specimen; (D) HA-based smart etching (SE)-etched specimen.
rde-45-e6f3.tif
Table 1.
Materials used, manufacturers, and major components
Material Trade name Manufacturer Main components
PA etching Etch-37 Bisco Inc., Schaumburg, IL, USA 37% PA gel
w/benzalkonium chloride
HA etching Porcelain Etchant Bisco Inc., Schaumburg, IL, USA 4% buffered HA gel
SE solution etching Smart Etching Yesbiogold Inc., Seoul, Korea 40% HA (vol %)
      59% PA (vol %)
      1% HCl (vol %)
Zirconia primer Z-prime Plus Bisco Inc., Schaumburg, IL, USA BPDM, HEMA, ethanol
MDP-containing resin cement G-CEM LinkAce GC Inc., Tokyo, Japan Paste A: Fluoro-alumino-silicate glass, UDMA, dimethacrylate, silicon dioxide silicon dioxide
Paste B: PA ester monomer (MDP), silicon dioxide, UDMA, dimethacrylate
MDP-free resin cement Duo-link Universal Bisco Inc., Schaumburg, IL, USA Base: Bis-GMA, TEGDMA, UDMA, glass filler
      Catalyst: Bis-GMA, TEGDMA, glass filler

PA, phosphoric acid; HA, hydrofluoric acid; SE, smart etching; HCl, hydrochloric acid; BPDM, biphenyl dimethacrylate; HEMA, hydroxyethyl methacrylate; UDMA, urethane dimethacrylate; MDP, methacryloyloxydecyl dihydrogen phosphate; Bis-GMA, bisphenyl A glycidyl methacrylate; TEGDMA, triethylene glycol dimethacrylate.

Table 2.
Shear bond strength values of each experimental group according to the use of methacryloyloxydecyl dihydrogen phosphate (MDP)-free or MDP-containing resin cement after etching the yttria-stabilized tetragonal zirconia polycrystal (Y-TZP) surface under various conditions
Etching condition Resin cement, Mean ± SD (MPa)
MDP-free resin cement MDP-containing resin cement
Control 8.50 ± 2.16 Aa 12.80 ± 0.81 Ab
37% PA at 20°C–25°C 12.37 ± 2.92 Ba 16.17 ± 0.99 Bb
4% HA at 20°C–25°C 12.60 ± 3.03 Ba 15.60 ± 2.55 Bb
HA-based SE at 70°C–80°C 16.15 ± 2.82 Ca 20.39 ± 2.29 Cb

SD, standard deviation; PA, phosphoric acid; HA, hydrofluoric acid; SE, smart etching.

Identical uppercase letters indicate no statistically significant differences (p > 0.05).

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