Abstract
Objectives
Materials and Methods
Results
Figures and Tables
![]() | Figure 1Effect of additional acid etching on the dentin bond strength (MPa) of adhesives. The asterisk indicates that there was significant difference.µTBS, microtensile bond strength; NOAE, no acid etching; AESEW, acid etching without ethanol wet-bonding; SE, Clearfil SE Bond; GB, Gaenial bond; XV, Xeno V; BB, BeutiBond; AE, Adper Easy Bond; SU, Single Bond Universal; AU, All bond Universal.
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![]() | Figure 2Effect of wetting etched dentin with ethanol on the dentin bond strength (MPa) of adhesives. The asterisk indicates that there was significant difference.µTBS, microtensile bond strength; AESEW, acid etching without ethanol-wet bonding; AEWEW, acid etching with ethanol-wet bonding; SE, Clearfil SE Bond; GB, Gaenial bond; XV, Xeno V; BB, BeutiBond; AE, Adper Easy Bond; SU, Single Bond Universal; AU, All bond Universal.
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Table 1
Compositions of materials used in this study

Compositions of the materials are provided by the manufacturers.
4-MET, 4-methacryloyloxyethyl trimellitate; MDP, methacryloyloxydecyl dihydrogen phosphate; Bis-GMA, bisphenol A glycidyl methacrylate; HEMA, 2-hydroxyethyl methacrylate; TEGDMA, triethyleneglycol dimethacrylate; UDMA, urethane dimethacrylate; Bis-EMA, ethoxylated bisphenol A dimethacrylate.
Table 2
Application procedures of self-etch systems

Table 3
Effect of additional acid etching and ethanol-wet bonding on the dentin bond strength (mean ± SD in MPa)

Values are expressed as means ± SD (n = 11 for each groups).
Different superscript letters indicate a statistically significant difference among groups (p < 0.05).
Results of two-way ANOVA: adhesives, p < 0.001; conditioning methods, p < 0.001; adhesives x conditioning methods, p < 0.001. NOAE, no acid etching; AESEW, acid etching without ethanol-wet bonding; AEWEW, acid etching with ethanol-wet bonding; SE, Clearfil SE Bond; GB, Gaenial bond; XV, Xeno V; BB, BeutiBond; AE, Adper Easy Bond; SU, Single Bond Universal; AU, All bond Universal; SD, standard deviation.
Table 4
Modes of failure after microtensile bond strength testing

Adhesive | NOAE | AESEW | AEWEW |
---|---|---|---|
SE | 0/11/0 | 0/11/0 | 0/5/6 |
GB | 0/10/1 | 1/10/0 | 0/11/0 |
XV | 0/11/0 | 0/11/0 | 0/11/0 |
BB | 0/11/0 | 0/11/0 | 0/11/0 |
AE | 0/9/2 | 0/11/0 | 0/11/0 |
SU | 0/8/3 | 0/9/2 | 0/6/5 |
AU | 0/11/0 | 0/10/1 | 0/7/4 |
Failure modes: mixed failure/adhesive failure/cohesive failure in dentin or composite.
NOAE, no acid etching; AESEW, acid etching without ethanol-wet bonding; AEWEW, acid etching with ethanol-wet bonding; SE, Clearfil SE Bond; GB, Gaenial bond; XV, Xeno V; BB, BeutiBond; AE, Adper Easy Bond; SU, Single Bond Universal; AU, All bond Universal.
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