A quantitative analysis about microleakage of all-in-one adhesives

Yong-Hee Kang; Soo-Il Shin; Dong-Hoon Shin

doi:10.5395/JKACD.2004.29.1.066

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Kang, Shin, and Shin: A quantitative analysis about microleakage of all-in-one adhesives

Original Article

Journal of Korean Academy of Conservative Dentistry

Journal of Korean Academy of Conservative Dentistry 2004; 29(1): 66-72.

Published online: 31 January 2004

DOI: https://doi.org/10.5395/JKACD.2004.29.1.066

A quantitative analysis about microleakage of all-in-one adhesives

Yong-Hee Kang, Soo-Il Shin, Dong-Hoon Shin

Department of Conservative Dentistry, College of Dentistry, Dankook University, Korea.

Corresponding author: Dong-Hoon Shin. Department of Conservative Dentistry, College of Dentistry, Dankook University, san 7-1, Shinbu-dong, Cheonan, Chungnam, Korea, 330-716. Tel: 041)550-1965, Fax: 041)550-1963, donyshin@dankook.ac.kr

(open-access):

This is an Open Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/3.0/) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

All-in-one adhesives were recently developed for reducing the techique sensitivity and chair time, but lots of concerns were made on bondability, longevity, and microleakage.

The object of this study was to evaluate microleakage and marginal quality of all-in-one adhesives using electrochemical method and SEM analysis quantitatively.

After making Class V cavities, they were bulk filled with Heliomolar(#A1) after surface treatment with three adhesives: Adper Prompt (Group A), One up bond F (Group O), Xeno III (Group X). Electrical conductivity (microamphere, µA) was checked two times: before and after cavity filling.

Percentage of leaky margin was estimated from SEM image (×1,000).

The data were statistically analysed: ANOVA and Paired T test for electrical conductivity, Kruskal-Wallis and Mann-Whitney test for marginal quality, Spearman's rho test for checking of relationships between 2 methods.

The result were as follows:

1. There was no difference in microleakage between adhesive systems and every specimen showed some of microleakage after filling.

2. Microleakage was reduced about 70% with composite resin filling.

3. Marginal quality was the best in group A, decreasing among groups in the following order: group O, followed by group X. There were significant differences between group A and group X (p=0.015), and between group O and group X (p=0.019).

4. There was no relationship between the microleakage measured by electrochemical method and marginal quality measured by SEM analysis.

Within the results of this study, there was no difference in microleakage among groups by electrical conductivity. However, significant difference in marginal quality was seen among groups. It was believed that these dissimilar results might be induced because of their own characteristics. Analysis of microleakage needs various methods for accuracy.

Keywords: Quantitative, Microleakage, Eelectrical Conductivity, Marginal adaptation, SEM, All-in-one adhesive

Figures and Tables

Fig. 1

Schematic drawing of electrochemical test

Table 1

Composite resin used for cavity filling

Table 2

All-in-one bonding systems

Table 3

Microleakage currents before and after cavity filling (Mean (S.D.) unit (µA))

^**: significant at the p<0.01 level

Table 4

Amount of current reduction with cavity filling (Mean (S.D.) unit (%))

Table 5

Percentage of marginal gap (%)

^*: significant at the p<0.05 level

Table 6

Correlations between two methods

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